NVIDIA AMD chips 結果共4筆

TSMC proposes a joint venture with NVIDIA, AMD, and Broadcom to manage an Intel wafer plant, aiming to revive Intel’s operations. Discussions are in early stages.

Discover how Taiwan’s Economic Minister Kuo Jyh-huei plans to boost tourism and national competitiveness at SEMICON Taiwan 2024, with 85,000 visitors expected, innovative AI developments, and strategic government incentives.

Explore how TSMC’s Chairman C.C. Wei addresses the impracticality of moving production from Taiwan amid geopolitical tensions and the impact on the global tech industry, ahead of COMPUTEX 2024.

Taiwan Semiconductor Manufacturing Company (TSMC) predicts a surge in artificial intelligence (AI) orders in the coming year, with October’s revenue reaching NT$243.203 billion ($8.6 billion), a 34.8 percent monthly increase and a 15.7 percent annual increase. TSMC’s stock price has also been on a steady rise, accumulating a growth of 7.5 percent since November. Morgan Stanley semiconductor research analyst Charlie Chan attributes TSMC’s revenue growth to signs of recovery and the robust demand for AI semiconductors worldwide. NVIDIA’s expanded order to TSMC, along with increased demand from clients like Apple and Advanced Micro Devices (AMD), has led TSMC to accelerate the enhancement of its advanced packaging technology, Chip on Wafer on Substrate (CoWoS). CoWoS enables TSMC to effectively reduce costs and trim electric consumption by packaging chiplets on a silicon interposer and placing them on a package substrate. However, TSMC’s current CoWoS capacity remains a bottleneck for NVIDIA’s AI GPU chips, though the company forecasts a rebound in productivity by the end of 2024 to meet customer demand.